TE Connectivity highlights power, thermal, and optical solutions for AI data centers at COMPUTEX 2026
At COMPUTEX 2026 in Taipei, TE Connectivity will demonstrate its latest connectivity solutions enabling next-generation AI infrastructure.
- 800V
What Happened
TE Connectivity will showcase its power, thermal, and optical solutions for AI data centers at COMPUTEX 2026. The company highlights its end-to-end high-voltage direct current (HVDC) power solutions, liquid-cooled power systems, and optical connectivity innovations.
“AI workloads are driving increasing demands on data center infrastructure—most critically in speed, density, power efficiency, and scalability.”
- End-to-end HVDC power solutions supporting 800V architectures
- Liquid-cooled power solutions with integrated vertical busbar technology
- End-to-end optical infrastructure from near-chip interfaces to rack-level solutions
“Our collaboration with TE at COMPUTEX 2026 highlights the important role of innovations such as HVDC, liquid-cooled busbar and optical scale-up in enabling next-generation AI data centers.”
Why this matters
As AI workloads demand higher speed, density, power efficiency, and scalability, TE's end-to-end connectivity solutions help enable efficient and sustainable AI data centers.
Terms in This Story
- HVDC
- High-voltage direct current, a power transmission system that uses direct current at high voltages to reduce losses over long distances.
- busbar
- A metal bar that distributes electrical power within a switchboard or enclosure.
Summarised from the linked release; details can be imperfect — always verify against the original source.