TE Connectivity highlights power, thermal, and optical solutions for AI data centers at COMPUTEX 2026
800V
What Happened
TE Connectivity will showcase its power, thermal, and optical solutions for AI data centers at COMPUTEX 2026. The company highlights its end-to-end high-voltage direct current (HVDC) power solutions, liquid-cooled power systems, and optical connectivity innovations.
“AI workloads are driving increasing demands on data center infrastructure—most critically in speed, density, power efficiency, and scalability.”
- End-to-end HVDC power solutions supporting 800V architectures
- Liquid-cooled power solutions with integrated vertical busbar technology
- End-to-end optical infrastructure from near-chip interfaces to rack-level solutions
“Our collaboration with TE at COMPUTEX 2026 highlights the important role of innovations such as HVDC, liquid-cooled busbar and optical scale-up in enabling next-generation AI data centers.”
Why this matters
As AI workloads demand higher speed, density, power efficiency, and scalability, TE's end-to-end connectivity solutions help enable efficient and sustainable AI data centers.
Terms in This Story
- HVDC
- High-voltage direct current, a power transmission system that uses direct current at high voltages to reduce losses over long distances.
- busbar
- A metal bar that distributes electrical power within a switchboard or enclosure.
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