onsemi unveils Embedded Power Platform, promising 3–5x power density for AI and EVs

onsemi unveiled the Embedded Power Platform (EPP), a new architecture that uses the silicon wafer itself as the foundation of the package rather than as passive housing. The platform integrates and interconnects silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies in a wafer-level architecture, embedding multiple devices — including FETs, drivers and controllers — in a single package that is co-optimized for electrical, thermal and mechanical performance. onsemi says EPP can deliver up to 3–5x higher power density than current solutions, depending on the application, while reducing development complexity and speeding time-to-market. It draws on onsemi's standard 12-inch silicon wafer manufacturing capabilities, applying mature semiconductor design tools, wafer-level manufacturing and advanced simulation to power-system integration.

onsemi says AI infrastructure, electrified transportation and industrial automation are all competing for the same critical resource: power. Customers need to move and manage more electricity within increasingly compact systems while controlling heat, efficiency, cost and development time. Many of today's power systems are still developed using traditional approaches that treat power electronics, mechanical design and thermal design as separate, sequentially optimized challenges, where decisions made at one stage create compromises in another and lead to additional engineering iterations, costly late-stage changes and longer development cycles. EPP is designed to replace that sequential model with a common platform that can be co-designed, co-simulated and co-optimized.

Electric vehicle traction inverters are often constrained by efficiency losses, thermal limitations, development complexity and system size; onsemi says EPP enables smaller, lighter and more efficient inverter designs, and that its scalable architecture supports a single inverter platform spanning low-end to high-end vehicle applications. That reuse could allow automakers to share a common design across multiple vehicle models and power classes, reducing R&D and manufacturing costs, accelerating qualification and development cycles, improving vehicle range or lowering system costs and bringing new vehicle programs to market faster. Subaru Corporation is one of the first early engagement partners for EPP, working with onsemi to evaluate how the platform could support future electrified vehicle architectures, with early access to engineering samples, simulation models and technical expertise. EPP is expected to begin sampling in 2026 with strategic customers and ecosystem participants across automotive and AI applications.