TE Connectivity to Showcase End-to-End Optical, Copper and Thermal Innovations for AI Data Centers at OFC 2026
1.6 Tbps
3.2 Tbps
What Happened
TE Connectivity, a world leader in connectors and sensors, will exhibit its end-to-end solutions for AI data centers at OFC 2026 (March 17-19, Los Angeles). The portfolio spans optical, copper, and thermal innovations to address the growing needs of AI workloads. Notably, the company will showcase a breakthrough high-density fiber array unit (FAU) capability, enabled by its recent acquisition of RAM Photonics, which uses advanced active alignment and automated optical fiber fusion splicing for industry-leading density and insertion loss.
- A CPC-to-CPO architecture featuring 1.6T Linear Receive Optics (LRO) enabled by TE's AdrenaLINE Catapult ultra-high-density connectors alongside 3.2T CPO integration.
- A CPO-to-optical backplane system illustrating an end-to-end passive optical path across the rack, integrating CPO/NPO sockets, FAUs, ELSFP connectivity, blind-mate optical connectors, and a high-dens
- Additional demonstrations of 1.6T LRO high-speed cable assemblies, optical transceivers, and FAU technology for next-generation optical interconnect architectures.
“As the industry moves toward higher-speed, optics-driven architectures, our strength in go-to-market and global manufacturing scaling helps support our customers in addressing critical near-chip optical connectivity challenges. Our recent acquisition of RAM Photonics strengthens TE’s optics portfolio by adding foundational high-density FAU capabilities, reinforcing our long-term investment and com”
Why this matters
As AI workloads demand higher bandwidth and efficiency, TE's innovations in co-packaged optics and copper help data centers scale performance while reducing power and improving signal integrity.
Terms in This Story
- Co-Packaged Optics (CPO)
- A technology that places optical components close to switch or compute silicon to reduce power and improve signal integrity.
- Co-Packaged Copper (CPC)
- A similar approach using copper interconnects for high-speed data transmission near silicon.
- Fiber Array Unit (FAU)
- A component that precisely aligns and fuses multiple optical fibers for high-density connections.
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