TE Connectivity to Showcase End-to-End Optical, Copper and Thermal Innovations for AI Data Centers at OFC 2026
TE Connectivity will demonstrate its portfolio of integrated optical, copper, and thermal solutions for AI data centers at OFC 2026, including a breakthrough high-density fiber array unit enabled by its recent acquisiti…
- 1.6 Tbps
- 3.2 Tbps
What Happened
TE Connectivity, a world leader in connectors and sensors, will exhibit its end-to-end solutions for AI data centers at OFC 2026 (March 17-19, Los Angeles). The portfolio spans optical, copper, and thermal innovations to address the growing needs of AI workloads. Notably, the company will showcase a breakthrough high-density fiber array unit (FAU) capability, enabled by its recent acquisition of RAM Photonics, which uses advanced active alignment and automated optical fiber fusion splicing for industry-leading density and insertion loss.
- A CPC-to-CPO architecture featuring 1.6T Linear Receive Optics (LRO) enabled by TE's AdrenaLINE Catapult ultra-high-density connectors alongside 3.2T CPO integration.
- A CPO-to-optical backplane system illustrating an end-to-end passive optical path across the rack, integrating CPO/NPO sockets, FAUs, ELSFP connectivity, blind-mate optical connectors, and a high-dens
- Additional demonstrations of 1.6T LRO high-speed cable assemblies, optical transceivers, and FAU technology for next-generation optical interconnect architectures.
“As the industry moves toward higher-speed, optics-driven architectures, our strength in go-to-market and global manufacturing scaling helps support our customers in addressing critical near-chip optical connectivity challenges. Our recent acquisition of RAM Photonics strengthens TE’s optics portfolio by adding foundational high-density FAU capabilities, reinforcing our long-term investment and com”
Why this matters
As AI workloads demand higher bandwidth and efficiency, TE's innovations in co-packaged optics and copper help data centers scale performance while reducing power and improving signal integrity.
Terms in This Story
- Co-Packaged Optics (CPO)
- A technology that places optical components close to switch or compute silicon to reduce power and improve signal integrity.
- Co-Packaged Copper (CPC)
- A similar approach using copper interconnects for high-speed data transmission near silicon.
- Fiber Array Unit (FAU)
- A component that precisely aligns and fuses multiple optical fibers for high-density connections.
Summarised from the linked release; details can be imperfect — always verify against the original source.