Live
PACCAR INC.PACCAR posts 19% higher Q3 2026 revenue of $7.94 billion and a 44% jump in net incomeDAF TRUCKS N.V.PACCAR posts 44% jump in third-quarter net income as revenues rise 19% to $7.94 billionOPEL AUTOMOBILE GMBHFive points cover Opel GSE Rally Cup top three ahead of Saarland-Palatinate finaleLANCIALancia marks 120 years with Design Days at Turin Heritage Hub from 4 to 7 NovemberMARUTI SUZUKI INDIA LIMITEDMaruti Suzuki sets record Q2 sales of 696,654 units, but profit falls to INR 24,149 millionOPEL AUTOMOBILE GMBHFranck Mulard to lead Opel's Eisenach plant from November 1 as Rafal Trojca moves to Stellantis Europe manufacturing roleŠKODAŠkoda Proud marks five years as Škoda Auto wins gold for LGBTQ+ inclusionMASERATI S.P.A.Maserati releases photo and video gallery from Auto e Moto d'Epoca 2026 in BolognaCONTINENTALContinental unveils ContiTrailAttack 4, a 90/10 adventure motorcycle tire due in Q1 2027MAN TRUCK & BUSMAN Engines, CLAAS and WTZ Roßlau study ammonia as fuel for heavy farm machineryOPEL AUTOMOBILE GMBHOpel Corsa GSE wins Carwow Car of the Year 2027 'fun-to-drive car' awardDODGEDodge Charger returns to Europe with electric Daytona and SIXPACK, backed by a new film seriesPACCAR INC.PACCAR posts 19% higher Q3 2026 revenue of $7.94 billion and a 44% jump in net incomeDAF TRUCKS N.V.PACCAR posts 44% jump in third-quarter net income as revenues rise 19% to $7.94 billionOPEL AUTOMOBILE GMBHFive points cover Opel GSE Rally Cup top three ahead of Saarland-Palatinate finaleLANCIALancia marks 120 years with Design Days at Turin Heritage Hub from 4 to 7 NovemberMARUTI SUZUKI INDIA LIMITEDMaruti Suzuki sets record Q2 sales of 696,654 units, but profit falls to INR 24,149 millionOPEL AUTOMOBILE GMBHFranck Mulard to lead Opel's Eisenach plant from November 1 as Rafal Trojca moves to Stellantis Europe manufacturing roleŠKODAŠkoda Proud marks five years as Škoda Auto wins gold for LGBTQ+ inclusionMASERATI S.P.A.Maserati releases photo and video gallery from Auto e Moto d'Epoca 2026 in BolognaCONTINENTALContinental unveils ContiTrailAttack 4, a 90/10 adventure motorcycle tire due in Q1 2027MAN TRUCK & BUSMAN Engines, CLAAS and WTZ Roßlau study ammonia as fuel for heavy farm machineryOPEL AUTOMOBILE GMBHOpel Corsa GSE wins Carwow Car of the Year 2027 'fun-to-drive car' awardDODGEDodge Charger returns to Europe with electric Daytona and SIXPACK, backed by a new film series
MotorClaw.news
Subscribe
Search releases, companies, topics...
Live2026-10-27 15:34 UTC+31 todayUpdated

TE Connectivity Unveils 56G MezzaWave Connectors for High-Speed Data Applications

TE Connectivity has launched its 56G MezzaWave connectors and cable assemblies, designed to support data rates up to 56 Gbps PAM4 for demanding applications like edge AI and data centers.

Data rate
56 Gbps PAM4
Pin count range
80 to 560
Mating cycles
1,000

What Happened

TE Connectivity, a global leader in connectivity and sensors, has launched its 56G MezzaWave connectors and cable assemblies. These components support data rates up to 56 Gbps PAM4 and are designed for high-density environments such as edge AI, data centers, industrial automation, robotics, and aerospace and defense. The connectors feature an open-pin-field array platform with design flexibility including multiple pin counts and stack heights.

Key Benefits
  • High-performance data support up to 56 Gbps PAM4
  • Design flexibility: pin counts 80–560, 1.27mm pitch, 7-10mm stack heights
  • Drop-in compatibility for easy upgrades without redesign
  • Rugged design rated for up to 1,000 mating cycles and -55°C to 125°C
“As data rates continue to accelerate, customers need interconnect solutions that can deliver performance and reliability. Our 56G MezzaWave connectors and cable assemblies offer multiple configuration options to help meet their system requirements and the modularity to allow for seamless upgrades.”
— Quinnie Lu, Product Manager at TE Connectivity
Maximum data rate

56 GbpsPAM4

Supports high-speed signal integrity in dense environments

Why this matters

The new connectors enable high-speed data transmission in dense environments without requiring a complete redesign, reducing costs and time for engineers working on next-generation modular systems.

Terms in This Story

PAM4
A modulation technique that uses four voltage levels to transmit 2 bits per symbol, doubling data rate over NRZ.
BGA
Ball grid array, a surface-mount packaging technology for integrated circuits.
VITA
VMEbus International Trade Association, an organization that sets standards for rugged embedded computing systems.
Read Original: TE Connectivity

Summarised from the linked release; details can be imperfect — always verify against the original source.

How useful was this article?

Feedback goes to the MotorClaw Desk and does not subscribe you to email. Privacy.