Hyundai Mobis and Qualcomm Collaborate on SDV Architecture for ADAS at CES 2026
Hyundai Mobis and Qualcomm signed a comprehensive agreement at CES 2026 to co-develop next-generation Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems (ADAS) solutions.
- 2026
What Happened
Hyundai Mobis and Qualcomm Technologies have signed a memorandum of understanding at CES 2026 to jointly develop integrated solutions for SDV and ADAS. The partnership will leverage Hyundai Mobis's expertise in system integration, sensor fusion, and perception alongside Qualcomm's leadership in system-on-chip (SoC) technology. Initial co-development will focus on advanced driving and parking solutions based on the Snapdragon Ride Flex SoC.
The companies aim to pursue global supply opportunities and target emerging markets such as India, where ADAS adoption is expanding across vehicle segments. For future SDV applications, they will work on next-generation integrated solutions combining Hyundai Mobis's standardized software platform with Qualcomm's Snapdragon automotive technologies to enhance performance, efficiency, and stability. At CES, Hyundai Mobis also hosted a private booth for global clients, attracting over 200 representatives from major North American and European customers.
Why this matters
This collaboration targets fast-growing markets like India, combining Mobis's system integration expertise with Qualcomm's SoC technology to accelerate ADAS adoption and SDV-ready architectures.
Terms in This Story
- SDV
- Software-Defined Vehicle; a vehicle whose features and functions are primarily enabled through software rather than hardware.
- ADAS
- Advanced Driver Assistance Systems; technologies that assist drivers with tasks like parking, lane keeping, and collision avoidance.
- SoC
- System-on-Chip; a single chip that integrates all components of a computer or electronic system, often used in automotive electronics.
Summarised from the linked release; details can be imperfect — always verify against the original source.