Micron Unveils Complete AI-Optimized Memory and Storage Portfolio at COMPUTEX 2026
At COMPUTEX 2026, Micron Technology announced its full suite of AI-optimized memory and storage solutions, spanning data center to intelligent edge, with key products now in production.
- 30x per year
- 2.6x per 2x bandwidth increase
- 9,200 MT/s
What Happened
Micron Technology today announced at COMPUTEX 2026 its complete portfolio of AI-optimized memory and storage solutions, covering both data center and intelligent edge applications. The portfolio includes HBM, DRAM, and NAND solutions designed to address the growing demands of AI workloads from training to inference.
“AI models' context length is exploding at 30x per year, while server memory capacity has only doubled in the past three years. Memory and storage have become indispensable strategic assets.”
2.6x
Per 2x bandwidth increase with HBM4 36GB 12H
- HBM4 36GB 12H for high-speed model execution
- 256GB SOCAMM2 with two-thirds less power and space
- 256GB DDR5 RDIMM at 9,200 MT/s, 40% faster
- Micron 9650 PCIe Gen6 SSD, first commercial Gen6 SSD
- Micron 6600 ION SSD up to 245TB, 82% less rack space
Why this matters
As AI model context windows grow exponentially, memory and storage have become strategic assets critical for AI inference and training performance, reshaping data center and edge computing architectures.
Terms in This Story
- HBM
- High Bandwidth Memory, a high-performance memory standard for AI and graphics.
- SOCAMM
- Small Outline Compression Attached Memory Module, a compact memory form factor.
- PCIe
- Peripheral Component Interconnect Express, a standard for connecting high-speed components.
- LLM
- Large Language Model, an AI model trained on vast text data for natural language tasks.
Summarised from the linked release; details can be imperfect — always verify against the original source.