Valeo and Calyos Partner to Develop Passive Two-Phase Cooling for Chips in Data Centers and Mobility
€20.9 billion
100,000
What Happened
Valeo and Calyos have signed a Memorandum of Understanding to develop and industrialize high-performance, standalone chip cooling solutions using passive two-phase loop heat pipe technology. The collaboration targets increasing thermal challenges in both mobility and data center sectors, driven by electrification and artificial intelligence.
- Power electronics: on-board chargers, inverters, and integrated power units for electric vehicles.
- Software Defined Vehicles: centralized computing controllers with high power density requirements.
- Data center servers: direct-to-chip cooling for air-cooled racks, enabling upgrades without facility overhaul.
“This cooperation with Calyos is a new step in our mission to lead the thermal management revolution. By integrating Calyos' Loop Heat Pipe expertise into Valeo's industrial ecosystem, we provide our customers in both the automotive and data center sectors with a unique cooling solution that is easy to integrate and scale, while significantly enhancing energy efficiency to support a more sustainabl”
Why this matters
This partnership combines Valeo's industrial scale with Calyos' innovative cooling technology to address the rising heat generated by AI and electrification, potentially enabling more efficient and reliable computing in cars and data centers.
Terms in This Story
- Loop Heat Pipe (LHP)
- A passive heat transfer device that uses the phase change of a working fluid to move heat efficiently without moving parts.
- Software Defined Vehicle (SDV)
- A vehicle whose functions are controlled primarily by software, allowing over-the-air updates and new features over time.
- Passive cooling
- A cooling method that does not rely on active components like pumps or fans, using natural processes such as phase change to dissipate heat.
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